Research activity at GRAF includes the design, optimization and testing of RF components, circuits and systems incorporating planar and non-planar technologies, such as: semiconductor substrates (e.g., silicon and III-V compound semiconductors); multilayered technologies including multichip modules, low-temperature co-fired ceramics, and PCB boards; and 3D printing.

One of the leading areas of expertise at GRAF is the modeling and optimization of integrated inductors and transformers. The research group has developed innovative methods to improve the performance of these components for general RF applications, and in particular for new homodyne transceiver architectures based on injection-locked oscillators. The research interests of GRAF members also focus on: the use of 3D simulators for electromagnetic analysis of RF components, circuits and systems; analysis of electromagnetic compatibility and electromagnetic interference problems; antenna design; and the interaction of electromagnetic energy with biological tissues. GRAF takes a special interest in the integration of packages of compact modules.

Current research focuses on assessing improvements in performance and the compactness of RF components and systems using fully 3D additive manufacturing techniques.

Research fields:

• Design and manufacture by 3D printing of passive components and circuits for RF applications.
• LTCC technology and its application in the implementation of RF modules.      
• Electromagnetic analysis and modeling of radiofrequency field interactions with biological tissues. 
• Antenna design for biomedical applications and associated issues related to electromagnetic propagation.
• Novel RF front-end architectures based on PSK to ASK and FSK to ASK signal conversion.
• Injection-locked oscillators and their application in RF digital communications.
• Chip package co-design methodology applied to RF systems.
• Design and characterization of integrated inductors and transformers for RFIC applications.
• Silicon micromachining techniques for RF applications.