Different test structures are shaped to obtain the materials EM properties using the resonant cavity method, as well as the coaxial and rectangular waveguide methods, and microstrip transmission line method.Cavity method setupCoaxial method setupMicrostrip transmission line method setupElectroless plating and electroplating setups for copper growth. The compatibility between the different printing materials and copper metallization is analyzed. The adhesion of conductive coatings and the behavior of the test structures when immersed in electrolytic baths are studied and optimized to obtain good quality selective mentalizations.
