Projects

Current and recent research projects:

  • Design, Fabrication, and Characterization of Advanced RF Components via Additive Manufacturing. Organism: Massachusetts Institute of Technology. Reference: MISTI0000000879.
  • Passive 3D UHF RFID tags. Reference: FBG-F2I-PdCl-2022-004.
  • Design, modeling and manufacturing of advanced 3D printed components and circuits for RF applications. Organism: Spanish Commission for Science and Technology. Reference: PID2021-124638OB-I00.
  • Design and manufacture by 3D printing of passive components and circuits for RF Applications. Organism: Spanish Commission for Science and Technology. Reference: TEC2017-83524-R.
  • RFID systems for industrial applications. Organism: Ideaded, S.L. Reference: FBG-UB 310249.  
  • Design, manufacturing and characterization of compact RFID systems in LTCC Technology. Organism: W115 – Francisco Albero, S.A. -F.A.E. Reference: FBG-UB 308811.  
  • Development of RF passive components, based on Ferrites and LTCC technology, for mid power applications. Organism: Spanish Commission for Science and Technology. Reference: TEC2013-40430-R.
  • Technological Innovation in Health. Organism: European Commission. Reference: EUUN-18180.
  • RFID Systems for biomedical applications. Organism: ID4S – ID4SENSE, S.L. Reference: FBG-UB 307215.  
  • Low cost circulators for Microwave Modules (LOCCIMIM). Organism: European Commission. Reference: EUR-11-127 LOCCIMIM.
  • Heterogeneous integration of RF & microwave systems using LTCC technology. Organism: Spanish Commission for Science and Technology. Reference: TEC2010-21484. 
  • Modeling and Integration of embedded passive components using LTCC technology.  Organism: Francisco Albero S.A. (FAE). Reference: FBG-UB 305101.  
  • Development of a CAD/CAE tool for the synthesis of passive components. Organism: University of Barcelona. Reference: PPV-027-07.  
  • Adaptive RF Front-End for the design of reconfigurable transceivers for 4G communication system applications. Organism: Spanish Commission for Science and Technology. Reference: TEC2007-67247-C02-02/MIC. 
  • Design, characterization and Modeling of RFIC test structures using SEIKO-EPSON CTH fabrication process (DECHAM-RF Project). Organism: SEIKO EPSON Corporation, EPSON Europe Gmbh. Reference: FBG-UB 303685.
  • Implementation of Short Range compact transceivers for applications in an Ambient Intelligence Environment (TRANSAMI Project). Organism: SEIKO EPSON Corporation, EPSON Europe Gmbh. Reference: FBG-UB 303081. 
  • Implementation of Short-Range compact transceivers using Silicon technologies for sensor networks applications in an Ambient Intelligence environment. Organism: Spanish Commission for Science and Technology. Reference: TEC2004-01081. 
  • Chip/Package Co-design Methodology applied to short rang RF systems. Organism: Spanish Commission for Science and Technology. Reference: TIC2001-2947-C02-01.